Which Compound to Use to Manufacture a Mobile Phone Back Cover

What Is It?

NEXXALAC™ Unfilled PC Compound is a polycarbonate resin valued for its high impact strength, low shrinkage, and premium surface aesthetic without added reinforcement.

How It's Manufactured

PC resin is compounded with color and stabilizer packages on a twin-screw or single-screw line. PC processes at a notably higher melt temperature than ABS or polyamides, so barrel temperature control during compounding is set specifically to avoid degrading the resin's clarity and impact properties.

Manufacturing Process for This Application

Mobile back covers are injection molded from PC pellets, typically pre-dried since PC is moisture-sensitive at melt temperature even though it is not as hygroscopic as polyamides. Low shrinkage and warpage let the thin, cosmetically critical cover mold flat and consistent across a high-volume production run.

Why Polymer Choice Matters Here

A phone back cover is dropped, flexed when the phone is handled, and judged purely on fit-and-finish — a lower-impact-strength polymer cracks on drop, while a higher-shrinkage polymer would not hold the tight fit tolerances a modern phone assembly needs against its other components.

Why This Compound Is Suited

PC's excellent aesthetic, surface finish and gloss, superior mechanical properties, and low shrinkage/warpage is exactly the property set a mobile back cover or electronic housing needs, and this is explicitly among the grade's listed applications.

Nexxa Compounds is a leading manufacturer of PC compounds for mobile back cover applications in India, supplying some of the largest manufacturers across India and internationally.

Alternate Compounds to Consider

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