Material Guide25 July 2026

Which Compound to Use to Manufacture a Printed Circuit Board Frame

What Is It?

NEXXALON™ Flame Retardant Glass Fiber Reinforced Compound combines glass fiber reinforcement with a halogenated flame retardant system, rated FR V0 at GWIT 960°C with roughly 30% glass loading.

How It's Manufactured

Glass fiber and flame retardant additive are compounded into the PA6 base on a twin-screw extruder, with screw and die configuration set to protect fiber length while ensuring the flame retardant package is uniformly distributed through the pellet.

Manufacturing Process for This Application

PCB frames and carbon brush holders are injection molded from the dried, reinforced FR compound. These parts sit in direct proximity to energized circuitry and moving electrical contacts, so mold design targets a smooth, defect-free surface at the specified wall thickness to hold the certified flammability rating consistently across the part.

Why Polymer Choice Matters Here

A frame holding an energized PCB in place needs the stiffness glass fiber provides to avoid flexing under vibration, plus flame retardancy for the same reason as any part adjacent to live current — an unfilled FR grade would flex more than the frame's mounting tolerances allow, while non-FR glass-filled PA6 would fail the fire-safety requirement outright.

Why This Compound Is Suited

The anti-dripping flammability behaviour combined with glass-fiber mechanical reinforcement is exactly what a PCB frame, connector, or brush holder needs, and these are the applications explicitly listed for this grade.

Nexxa Compounds is a leading manufacturer of PA6 compounds for printed circuit board frame applications in India, supplying some of the largest manufacturers across India and internationally.

View full PA6 compound specification →

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